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EndsemNov 20252019 patternBE E&TC

Electronic Product Development (EPD) SPPU Endsem Question Paper Nov 2025

All 8 questions from this SPPU endsem paper, as printed. Read them here or open the PDF.

Subject code
404185 B
Pattern
2019 pattern
Exam
Endsem
Session
Nov 2025
Max. marks
70
Time
2½ Hours
Semester
VII
Paper code
[6584]-143

Printed for: B.E. (Electronics & Telecommunication Engineering)

Instructions to the candidates

  1. Attempt Q.1 or Q.2, Q.3 or Q.4, Q.5 or Q.6, Q.7 or Q.8.
  2. Neat diagrams must be drawn wherever necessary.
  3. Figures to the right indicate full marks.
  4. Assume suitable data, if necessary.

Questions

  1. Q1

    1. a)

      Explain methods of product debugging.

      Also asked:May 2024

      [8]
    2. b)

      Explain in detail mechanism for cooling for an electronic product.

      [10]
  2. Q2

    1. a)

      Describe documentation preparation for product.

      [8]
    2. b)

      Write a note on: i) User interface ii) Embedded and real-time software.

      [10]
  3. Q3

    1. a)

      Explain the waterfall model of software development.

      [7]
    2. b)

      State the salient features of i) Algorithm ii) Flowchart iii) Pseudo code

      [10]
  4. Q4

    1. a)

      Discuss any One with the help of a neat diagram /schematic. i) Structured programming ii) Coupling and cohesion

      [7]
    2. b)

      Explain the spiral model of software development. 2

      Also asked:Nov 2024 ·May 2023 ·Nov 2022

      [10]
  5. Q5

    1. a)

      Discuss the development plan for risk abatement in software development.

      [8]
    2. b)

      What is real-time software? Explain its significance in product design with examples.

      Also asked:May 2024

      [10]
  6. Q6

    1. a)

      Define / Explain the following terms associated with PCB design. i) Containment ii) Electromagnetic interference (EMI) iii) Electromagnetic compatibility (EMC) iv) Immunity v) Susceptibility vi) Suppression vii) Electrostatic discharge (ESD) viii) Transmission mode of RF energy

      [10]
    2. b)

      Explain fan and forced cooling.

      [8]
  7. Q7

    1. a)

      What is testing and debugging? Explain the steps indebugging.

      [6]
    2. b)

      Discuss tips for troubleshooting analog circuits and digital circuits. Also discuss the checklist for powering circuits during troubleshooting and debugging.

      [6]
    3. c)

      With respect to the debugging process. explain the different types of characterization of components.

      [5]
  8. Q8

    1. a)

      What are electromechanical components? Explain any two electromechanical components.

      [6]
    2. b)

      Define documentation. What are the different types of documents to be prepared by the product manufacturer?

      [6]
    3. c)

      Discuss the visual techniques of documentation with suitable examples. ♣♣♣

      Also asked:May 2025 ·May 2024

      [5]