Electronic Product Development (EPD) SPPU Endsem Question Paper Nov 2023
All 8 questions from this SPPU endsem paper, as printed. Read them here or open the PDF.
- Subject code
- 404185B
- Pattern
- 2019 pattern
- Exam
- Endsem
- Session
- Nov 2023
- Max. marks
- 70
- Time
- 2½ Hours
- Semester
- VII
- Paper code
- [6181]-182
Printed for: B.E. (E & TC)
Instructions to the candidates
- Answer Q.1 or Q.2, Q.3 or Q.4, Q.5 or Q.6, Q.7 or Q.8.
- Neat diagrams must be drawn wherever necessary.
- Figures to the right indicate full marks.
- Use of logarithmic tables slide rule, Mollier charts, electronic pocket calculator and steam tables is allowed.
- Assume suitable data, if necessary.
Questions
Q1
- a)[8]
Explain in detail Software Bugs and Testing?
- b)[9]
What are the types of Software? Explain Traditional Software Life Cycle.
Also asked:May 2025
OR- a)
Q2
- a)[8]
Explain Risk Abatement and Failure Preventions in Software Design and Testing Methods.
- b)[9]
What are software bugs introduced how to locate and eliminate them.
Also asked:Nov 2022
- a)
Q3
- a)[9]
What is PCB? Elaborate PCB standards. What are the grounding Methodologies?
- b)[9]
Define/explain the following terms associated with PCB design i) Containment ii) Electromagnetic interference (EMI) iii) Electromagnetic compatibility (EMC)
Also asked:May 2024
OR- a)
Q4
Q5
- a)[9]
- b)[9]
Compare Electromechanical, Active and Passive Components?
ORQ6
- a)[9]
- b)[9]
Q7
ORQ8
- a)[9]
What is concept of Bill of Material (BOM)? Explain with suitable example.
- b)[8]
This part has equations that don’t show as text. Open the PDF to read it.
- a)